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novolac epoxy NPPN-638S

novolac epoxy NPPN-638S

Short Description:

Product Description

NPPN-638S is a phenolic epoxy resin featuring a heat-resistant aromatic backbone and multiple epoxy functional groups, providing high crosslinking density. Due to its structural characteristics, it offers a wide processing window. NPPN-638S can be cured with various hardeners such as polyurethane, phenolic, polyester resins, or different acid anhydrides to produce high-performance circuit board prepregs or composite materials. The resulting substrates exhibit high Tg values, excellent thermal stability, and superior chemical resistance.NPPN-638S is a phenolic epoxy resin featuring a heat-resistant aromatic backbone and multiple epoxy functional groups, providing high crosslinking density. Due to its structural characteristics, it offers a wide processing window. NPPN-638S can be cured with polyurethane, phenolic, polyester resins, or various acid anhydrides to produce high-performance circuit board prepregs or composite materials. The resulting substrates exhibit high Tg values, excellent thermal stability, and superior chemical resistance.


Product Detail

Product Tags

Product Data

Quality Project Unit Control scope
Appearance - semi-solid state

 

epoxide equivalent g/eq 170~190
hue

 

Gardner 0.0~3.0
Dissolution viscosity 25°C H~J
specific gravity (g/cm3 25°C) 1.18

Application

Circuit board substrate, composite material, civil engineering.


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